PCBA SMT Process & Quality Control

SMT stability directly determines PCBA yield and reliability.

Solder Paste

Control stencil tension, paste viscosity and printing speed.

Placement

Precise placement and optimized changeover to avoid shift and tombstone.

Reflow

Accurate temperature profile, peak time and ramp rate.

Inspection

AOI for appearance, X-Ray for hidden joints (BGA/QFN), plus functional test and burn-in.

Jinzer has in-house SMT lines and labs following IPC standards.